High-speed signal acquisition and processing requires a series of connection and switching at the front end of oscilloscope.
The signal is transmitted from the DUT to the oscilloscope, via coaxial cable to the PCB, through the ball gate array (BGA) package, and then to the first integrated circuit (IC) for analog amplification or attenuation. The signal output package is then delivered to the PCB and sent to the next package containing the track and hold (T/H) IC. Only after this string of connections is the signal ready for sampling, analog-to-digital conversion, and storage. Unfortunately, this series of connections and switches and subsequent iterations degrade the signal before sampling, thereby compromising oscilloscope bandwidth and signal fidelity.
To overcome these problems, teck USES custom designed, highly integrated front-end multi-chip modules (MCM) in the DPO/ dsa7000d series oscilloscopes. MCM incorporates a variety of front-end acquisition and processing components, including coaxial cable input connectors, preamplifiers, tracking and holding chips, and terminal resistors, into one package, so that the PCB is never touched until the high-speed signal is sampled.
The custom front MCM package for the DPO/ dsa7000d series brings together a large number of previously dispersed components, including
● Two preamplifier chips;
● An 8-way tracking and holding (T/H) chip with analog filter;
● High performance 100GHz bandwidth connector
● Flexible connector to PCB.
Because it is a self-contained module, MCM reduces the number of connections through which signals flow and the number of possible sources of error. The user will not have multiple signal jumps through the single chip package and PCB layer, which will degrade the signal fidelity and oscilloscope bandwidth before sampling. Using high-performance cables, high-speed signals are transmitted directly from oscilloscope inputs to MCM and internal integrated circuits. IBM's 8HP technology is a 130-nanometer (nm)SiGe bipolar complementary metal oxide semiconductor (BiCMOS) process that performs twice as well as previous generation processes.