8560EC spectrum analyzer 30 HZ-2.9 GHZ
Fast digital resolution bandwidths of 1 Hz to 3 MHz
Portable, MIL-PRF-28800, Class 3 rugged
Easily transfer screen image or trace data to PC with BenchLink software
Packaging & Shipping
Pack the instrument with PE bubble bag
Foam-in-place to protect the instrument
Fasten the carton with Belt
Pack the carton with PE film to waterproof
All values are in USD and do not include the customs duties & taxes and other surcharges.
The instrument will ship out within 5 days upon payment received.
We usually choose FedEx/DHL International Economy. Other shipment way is also acceptable
30days warranty, No ROR
During the warranty date, the buyer can return the item if have quality problem.
If you want to return the instruments, the return item has to be the original packing. Without my permission, the instrument cannot be dismantled.
You are responsible for returning the item and paying for return shipping. The payment for the freight cost will not return. Only payment for the instrument will be refund.
The refund will complete within 7 working days after we receive the return items
How to deal with the damage of oscilloscope bandwidth and signal fidelity?
High-speed signal acquisition and processing requires a series of connection and switching at the front end of oscilloscope.
The signal is transmitted from the DUT to the oscilloscope, via coaxial cable to the PCB, through the ball gate array (BGA) package, and then to the first integrated circuit (IC) for analog amplification or attenuation. The signal output package is then delivered to the PCB and sent to the next package containing the track and hold (T/H) IC. Only after this string of connections is the signal ready for sampling, analog-to-digital conversion, and storage. Unfortunately, this series of connections and switches and subsequent iterations degrade the signal before sampling, thereby compromising oscilloscope bandwidth and signal fidelity.
To overcome these problems, teck USES custom designed, highly integrated front-end multi-chip modules (MCM) in the DPO/ dsa7000d series oscilloscopes. MCM incorporates a variety of front-end acquisition and processing components, including coaxial cable input connectors, preamplifiers, tracking and holding chips, and terminal resistors, into one package, so that the PCB is never touched until the high-speed signal is sampled.
The custom front MCM package for the DPO/ dsa7000d series brings together a large number of previously dispersed components, including
● Two preamplifier chips;
● An 8-way tracking and holding (T/H) chip with analog filter;
● High performance 100GHz bandwidth connector
● Flexible connector to PCB.
Because it is a self-contained module, MCM reduces the number of connections through which signals flow and the number of possible sources of error. The user will not have multiple signal jumps through the single chip package and PCB layer, which will degrade the signal fidelity and oscilloscope bandwidth before sampling. Using high-performance cables, high-speed signals are transmitted directly from oscilloscope inputs to MCM and internal integrated circuits. IBM's 8HP technology is a 130-nanometer (nm)SiGe bipolar complementary metal oxide semiconductor (BiCMOS) process that performs twice as well as previous generation processes.
Window technology in frequency domain of oscilloscope
The FFT function of oscilloscope USES window technology to reduce the influence of spectrum leakage.Before executing the DFT, the DFT frame is multiplied by a window function of the same length for each sample.Window functions are usually bell-shaped and reduce or eliminate discontinuities at both ends of the DFT frame.
The four most commonly used window functions are listed below for recommended purposes: